• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration

Patent holdings for IPC class H01L 27/06

Total number of patents in this class: 6919

10-year publication summary

699
738
695
731
748
703
574
590
562
164
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
36809
692
Semiconductor Energy Laboratory Co., Ltd.
10902
520
Fuji Electric Co., Ltd.
4750
314
International Business Machines Corporation
60644
234
Texas Instruments Incorporated
19376
201
Samsung Electronics Co., Ltd.
131630
195
Micron Technology, Inc.
24960
193
Intel Corporation
45621
170
Renesas Electronics Corporation
6305
151
Rohm Co., Ltd.
5843
145
GLOBALFOUNDRIES U.S. Inc.
6459
139
Mitsubishi Electric Corporation
43934
135
Monolithic 3D Inc.
270
135
Qualcomm Incorporated
76576
131
Infineon Technologies AG
8189
112
Denso Corporation
23338
100
Semiconductor Components Industries, L.L.C.
5345
91
Infineon Technologies Austria AG
1954
88
Toshiba Corporation
12017
83
Sony Semiconductor Solutions Corporation
8770
78
Other owners 3012